Common thicknesses are 0.08 mm, 0.10 mm, 0.12 mm, 0.15 mm, and 0.20 mm. Thinner foils (0.08–0.12 mm) are recommended for fine-pitch components, while thicker foils are better for large pads requiring higher solder volume. We can provide professional recommendations based on component packages and area ratios.
Yes, fully customizable. Based on Gerber files or customer drawings, we can produce special apertures, local step-up/step-down, and 3D structures. Standard samples are ready in 1–3 days; urgent orders can be shipped in as little as 6 hours. We are a direct factory with full process traceability.
Under normal use, a laser-cut stencil can last tens of thousands of print cycles. Lifespan is mainly affected by cleaning method, squeegee pressure, and solder paste type. We recommend using dedicated wiping paper, controlling squeegee pressure, cleaning promptly, and avoiding hard objects. We also offer nano-coating upgrades that significantly extend service life.
Standard minimum aperture is 0.08 mm; smaller micro-apertures are possible for special applications. Positional accuracy reaches ±0.005 mm and dimensional accuracy ±0.01 mm. We use CCD vision alignment systems and full automatic optical inspection. Every stencil undergoes 2D/3D measurement before shipment to ensure ≥99.5% consistency across the entire board.
