The Round Multi-station Circular Hollow High-Density Micro-Hole Precision Metal Sheet (also known as Wafer-level SMT Circular Stencil, Multi-station Circular Micro-Hole Etching Steel Sheet, Semiconductor Wafer Processing Carrier, Precision Filter Disc) is an ultra-high-precision process component specially designed for semiconductor wafer processing, SMT surface mount, precision filtration, wafer-level packaging/testing, and medical microfluidics. The product is integrally formed by high-precision chemical etching / ultrafast laser precision drilling process with imported high-flatness 304/316L stainless steel (optional nickel, titanium alloy, molybdenum and other special metals) as the substrate. Through customized array multi-group circular hollow stations, full-area high-density micro-hole array, standardized positioning holes and fool-proof structure, it realizes micron-level precise processing, positioning and fluid/gas diversion. It completely solves industry pain points such as uneven micro-holes, stress deformation, positioning deviation, and insufficient filtration accuracy in traditional processing, greatly improving the yield and production efficiency of wafer processing, SMT production, precision filtration and other processes. It is the core precision tool for wafer-level and circular equipment scenarios.

The Round Multi-station Large Aperture Array Precision Metal Sheet (also known as Wafer-level Precision Distribution Disc, Multi-station Large Aperture Laser Drilling Steel Sheet, Semiconductor Wafer Processing Carrier, Precision Filter Disc) is an ultra-high-precision process component specially designed for semiconductor wafer processing, SMT surface mount, precision fluid/gas distribution, precision fixture manufacturing, industrial filtration and other fields. The product is integrally formed by ultrafast laser precision drilling / high-precision chemical etching process with imported high-flatness 304/316L stainless steel (optional nickel, titanium alloy, molybdenum and other special metals) as the substrate. Through customized full-area array large-aperture round holes, standardized positioning holes and fool-proof circular substrate structure, it realizes micron-level precise processing, positioning and uniform fluid/gas distribution. It completely solves industry pain points such as uneven aperture, stress deformation, positioning deviation, and uneven distribution in traditional processing, greatly improving the yield and production efficiency of wafer processing, SMT production, fluid distribution and other processes. It is the core precision tool for wafer-level and circular equipment scenarios.

The Round Multi-station Square-in-Circle Composite Hollow Precision Metal Sheet (also known as Wafer-level SMT Composite Structure Stencil, Square-in-Circle Precision Etching Fixture, Semiconductor Wafer Packaging Carrier) is an ultra-high-precision core process component specially designed for semiconductor wafer-level packaging, SMT surface mount, high-precision PCB assembly, precision fixture manufacturing, and semiconductor testing. The product is integrally formed by high-precision chemical etching / ultrafast laser precision cutting process with imported high-flatness 304/316L stainless steel (optional nickel, titanium alloy, molybdenum and other special metals) as the substrate. Through customized layered multi-group "square hollow with embedded circular through-hole" composite structure stations, full-area reference positioning holes and fool-proof circular substrate, it realizes micron-level precise solder paste coating, component positioning and wafer processing. It completely solves industry pain points such as stress deformation, burrs, positioning deviation, and printing bridging in traditional composite structure processing, greatly improving the yield and production efficiency of the entire wafer-level SMT production and semiconductor packaging process. It is a customized precision tool for wafer-level and circular equipment scenarios.

The Gear-Shaped High-Density Grid Precision Metal Sheet (also known as Rotary Precision Etching Filter Mesh, Gear-Shaped High-Density Grid Laser Steel Sheet, Semiconductor Wafer Rotary Processing Fixture) is an ultra-high-precision core precision processing component specially designed for precision filtration, rotary fluid/gas treatment, semiconductor wafer rotary processing, optical mask manufacturing, precision transmission fixture and other fields. The product is integrally formed by high-precision chemical etching / ultrafast laser precision cutting process with imported high-flatness 304/316L stainless steel (optional nickel, titanium alloy, molybdenum and other special metals) as the substrate. Through customized gear-shaped serrated outer edge, full-area high-density square grid array, central reference shaft hole and positioning installation structure, it realizes micron-level precise processing and transmission positioning. It completely solves industry pain points such as stress deformation, burrs, uneven grid, and transmission deviation in traditional rotary processing, greatly improving the consistency and yield of processes such as rotary filtration, wafer processing, and optical mask manufacturing. It is the core customized precision tool for rotary precision processing scenarios.

The Round Multi-station Square Hollow Precision Metal Sheet (also known as Wafer-level SMT Placement Stencil, Multi-station Square Hollow Etching Steel Sheet, Semiconductor Wafer Processing Carrier) is an ultra-high-precision process component specially designed for semiconductor wafer processing, SMT surface mount, precision fixture manufacturing, and wafer-level packaging/testing. The product is integrally formed by high-precision chemical etching / ultrafast laser precision cutting process with imported high-flatness 304/316L stainless steel (optional nickel, titanium alloy and other special metals) as the substrate. Through customized layered multi-group square hollow stations, full-area positioning holes and circular adaptation structure, it realizes micron-level precise processing and positioning. It completely solves industry pain points such as stress deformation, burrs, and positioning deviation in traditional processing, greatly improving the yield and efficiency of wafer processing, SMT production and other processes. It is the core precision tool for wafer-level and circular equipment scenarios.