Yes. Nano-coated step stencils combine precise volume control with excellent paste release — an ideal solution for high-end mixed-technology boards.

Step-height tolerance reaches ±0.01 mm. We support 1–3 levels or more. Our process combines laser cutting with precision forming to create smooth transitions that protect the squeegee.

When the same PCB contains both large pads (BGA, connectors) and tiny components (0201, 01005), a flat stencil cannot deliver the correct solder volume for both. Step stencils use local thickness variations so one print accurately controls solder volume in different areas, preventing insufficient solder on large components and bridging on small ones.