Our step SMT precision steel mesh (stepped steel mesh) is a high-end SMT printing consumable designed to solve the printing challenge of multiple height devices on the same board. Through precise local thickening/thinning processes, different thickness gradients are achieved on the same steel mesh, perfectly adapting to the solder paste printing needs of mixed-height PCBs such as BGA, QFN, connectors, and high-power devices. It is a core tool for complex board assembly.
Our vacuum coated stepped steel mesh is a precision mask consumable specially designed for high vacuum and high temperature coating processes. Innovatively integrating step thickness control and micro opening technology, using high-temperature resistant and highly stable material structures, to achieve precise graphical thin film deposition and film thickness gradient control. It is a semiconductor MEMS、 The core choice for precision coating in high-end fields such as optical components.
Our dual-process ladder SMT precision steel mesh innovatively integrates two core processes: ladder thickness control and precision grid micro-perforation. It is specifically designed for complex PCBs where multiple heights and types of devices coexist. It serves as a core tool for solving the challenges of differentiated solder paste supply and micro-scale precision printing, and is widely used in high-end semiconductors, automotive electronics, and other fields.
Our 3D step SMT precision steel mesh is a high-end SMT printing consumable developed to solve the printing problems of multiple heights and types of devices on the same board. Through precise 3D step forming technology, multi-level thickness gradient can be achieved on a single steel mesh, perfectly adapting to the solder paste printing requirements of mixed height PCBs such as BGA, QFN, connectors, power devices, etc. It is the core tool for complex high-density board mounting.
PCB stencil (also known as SMT solder paste stencil, SMT stencil) is an indispensable core precision auxiliary tool in SMT surface mount technology, and a key tooling to ensure solder paste printing accuracy and improve soldering yield.
This Photovoltaic 0BB (Zero Busbar) Nano Stencil is a high-end precision printing auxiliary tool specially designed for silver paste printing of photovoltaic 0BB cells. Built on high-precision laser-cut stencils, it delivers an all-round performance upgrade via cutting-edge nano surface modification technology, perfectly meeting the high-precision fine grid printing requirements of 0BB cells. It fundamentally solves industry pain points of traditional stencils such as printing defects, short service life and frequent cleaning, helping photovoltaic cell manufacturers improve efficiency, reduce costs and boost yield.
We specialize in the research, development, and custom processing of micro- and nano-scale precision steel meshes. Leveraging cutting-edge femtosecond/picosecond laser technology, we achieve micron-level and even submicron-level drilling precision and ultra-high-density array processing. We provide ultra-precise printing/coating core consumables for cutting-edge fields such as advanced semiconductors, microfluidics, and MEMS, enabling efficient and stable mass production of micro-devices.
Our FG nano-steel mesh, based on high-precision laser steel mesh, is a high-end SMT printing consumable equipped with a proprietary nano-coating process. For high-density, fine-pitch PCB assembly scenarios, it significantly enhances solder paste release performance, reduces printing defects, and greatly extends the service life of the steel mesh. It is the core choice for achieving efficient and stable production in the high-end electronic manufacturing field.
Our high-end precision nano-steel mesh is a core SMT printing consumable tailored for advanced electronic manufacturing. Based on micron-level laser steel mesh, it incorporates a proprietary nano-coating process specifically designed for fine-pitch, high-density devices such as BGA, QFN, and CSP. It enables extremely stable solder paste printing and serves as a quality assurance for mass production of high-end electronic products.
Our Nano stencil is a high-end SMT printing consumable equipped with exclusive nano coating technology on the basis of high-precision laser steel mesh. For high-density and fine pitch PCB mounting scenarios, it can significantly improve solder paste demolding performance, reduce printing defects, and significantly extend the service life of steel mesh. It is the core choice for achieving efficient and stable production in the high-end electronic manufacturing field.
We specialize in the customized precision processing of PCB laser stencils. Centered on micron-level laser cutting technology, we provide highly consistent solder paste / red glue printing solutions for various long-strip, special-shaped and fine-pitch PCBs, helping electronics manufacturers improve mounting yield and production efficiency.
With years of deep expertise in laser stencil processing, we leverage cutting-edge laser cutting technology to deliver micron-level precision stencil solutions for high-end industries including electronics manufacturing, semiconductor packaging, and new energy batteries. From standard SMT stencils to specialized step stencils, we strive to achieve perfect ink deposition on every pad, helping our clients boost production yields and reduce costs effectively.
Our Precision Laser Stencil is a high-precision microstructure consumable created based on cutting-edge femtosecond/picosecond laser processing technology. It is designed specifically for micro scale manufacturing scenarios such as microfluidics, precision coating, and optical masks. With extremely uniform micro scale stripe/grid structures, it provides precise graphic transfer and material deposition solutions for cutting-edge scientific research and high-end industrial production.
Our SMT Laser Stencil is the core basic consumable for SMT mounting technology in the field of electronic manufacturing. Relying on high-precision fiber laser cutting technology, providing precise and stable solder paste printing solutions for various conventional and fine pitch PCBs is a key choice to ensure the yield and production efficiency of electronic product mounting.
SMT stencil is a core precision auxiliary tool in SMT surface mount technology, which ensures solder paste printing accuracy and improves soldering yield. Standardized operation and maintenance are the keys to extending stencil service life and stabilizing printing quality. The specific guidelines are as follows:
The Step SMT Stencil (also known as Stepped SMT Stencil, Differential Thickness SMT Printing Stencil) is a high-precision customized process stencil specially designed for the differentiated solder paste printing requirements of different heights and packages of components on the same PCB in the SMT surface mount production line. Made of high-purity stainless steel substrate, the product is integrally processed by laser cutting + step forming, realizing the differential thickness design of different areas on the same stencil, accurately controlling the solder paste printing volume of different pads. It completely solves the industry pain point that ordinary flat stencils cannot meet the solder paste requirements of large components (BGA/IC/connectors) and small components (0201/01005 micro resistors/capacitors) at the same time, realizing one-time printing to complete the full-board solder paste coating, greatly improving SMT printing efficiency and placement yield, and is the core process consumable for SMT mass production in high-end electronic manufacturing.
Our laser precision SMT steel mesh is a core printing consumable tailored for conventional PCB and small device mounting. Relying on high-precision fiber laser cutting technology, providing efficient and reliable solder paste printing solutions for electronic manufacturing with extremely stable structure and micrometer level hole accuracy, is the basic choice to ensure batch production yield and efficiency.
We specialize in the custom processing of precision laser stencils, particularly in the precision manufacturing of ultra-long and narrow stencils. We provide high-flatness, high-consistency solder paste printing solutions for LED display, new energy, automotive electronics and other industries, perfectly matching the assembly requirements of long PCBs and fine-pitch components.
